JPH0713219Y2 - 半導体封止プレスの油圧ユニット - Google Patents
半導体封止プレスの油圧ユニットInfo
- Publication number
- JPH0713219Y2 JPH0713219Y2 JP7558389U JP7558389U JPH0713219Y2 JP H0713219 Y2 JPH0713219 Y2 JP H0713219Y2 JP 7558389 U JP7558389 U JP 7558389U JP 7558389 U JP7558389 U JP 7558389U JP H0713219 Y2 JPH0713219 Y2 JP H0713219Y2
- Authority
- JP
- Japan
- Prior art keywords
- oil
- semiconductor
- hydraulic unit
- semiconductor sealing
- sealing press
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 17
- 238000007789 sealing Methods 0.000 title claims description 4
- 239000003921 oil Substances 0.000 claims description 24
- 239000010720 hydraulic oil Substances 0.000 claims description 8
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229920002545 silicone oil Polymers 0.000 description 9
- 239000003595 mist Substances 0.000 description 5
- 239000008188 pellet Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7558389U JPH0713219Y2 (ja) | 1989-06-29 | 1989-06-29 | 半導体封止プレスの油圧ユニット |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7558389U JPH0713219Y2 (ja) | 1989-06-29 | 1989-06-29 | 半導体封止プレスの油圧ユニット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0316332U JPH0316332U (en]) | 1991-02-19 |
| JPH0713219Y2 true JPH0713219Y2 (ja) | 1995-03-29 |
Family
ID=31616281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7558389U Expired - Lifetime JPH0713219Y2 (ja) | 1989-06-29 | 1989-06-29 | 半導体封止プレスの油圧ユニット |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713219Y2 (en]) |
-
1989
- 1989-06-29 JP JP7558389U patent/JPH0713219Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0316332U (en]) | 1991-02-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2887628A (en) | Semiconductor device construction | |
| JP2002147888A (ja) | 熱電変換デバイス及びその製造方法 | |
| JPH0713219Y2 (ja) | 半導体封止プレスの油圧ユニット | |
| JPS5683048A (en) | Semiconductor device | |
| US9574912B2 (en) | Sensor element | |
| CN85108787A (zh) | 用于内燃机防护的压力补偿温度开关装置 | |
| US3066248A (en) | Semiconductor device | |
| JP2003086976A (ja) | 電子機器の放熱構造 | |
| CN209526019U (zh) | 一种防尘迷宫结构、电动工具开关及电动工具 | |
| GB2019645A (en) | Semiconductor device protected against overvoltages | |
| CN209359666U (zh) | 具有热电转换功效的套壳以及使用该套壳的烟草加热装置 | |
| CN217239280U (zh) | 一种封装电容器 | |
| JPS61218148A (ja) | 放熱制御装置 | |
| JPS5433665A (en) | Manufacture for resin sealed type semiconductor device and resin sealed metal mold | |
| CN218066793U (zh) | 一种新能源汽车用温度传感器 | |
| CN1640525A (zh) | 旋转式气体吸附浓缩装置 | |
| JPS5629352A (en) | Resin-sealed semiconductor device | |
| JPH04196472A (ja) | 半導体装置 | |
| JPH0225262Y2 (en]) | ||
| CN106298703A (zh) | 能够改善散热效能的快充mosfet封装结构 | |
| GB886451A (en) | Improvements in or relating to semi-conductors | |
| JPS5496977A (en) | Semiconductor device | |
| JPH0544995Y2 (en]) | ||
| KR920022430A (ko) | 고출력용 반도체의 수지봉합 장치 | |
| JPS5923426Y2 (ja) | 半導体冷却装置 |